@article {Nila:2018:0736-2935:114,
title = "Application of 3D Digital Image Correlation for Full-Field Vibration Measurements",
journal = "INTER-NOISE and NOISE-CON Congress and Conference Proceedings",
parent_itemid = "infobike://ince/incecp",
publishercode ="ince",
year = "2018",
volume = "257",
number = "1",
publication date ="2018-12-01T00:00:00",
pages = "114-121",
itemtype = "ARTICLE",
issn = "0736-2935",
url = "https://ince.publisher.ingentaconnect.com/content/ince/incecp/2018/00000257/00000001/art00012",
keyword = "optical measurement, DIC, modal analysis, FSI",
author = "Nila, Alex and Hollis, David and Grewer, Manuel and Nagel, Horst and Prevost, R.",
abstract = "Digital Image Correlation (DIC) is a well-established non-intrusive, full-field technique that is extensively used for measuring surface displacement and displacement derivatives such as material strain. The application of this technique has seen a considerable raise in popularity over
the course of the last decade, with an increasing array of applications focusing particularly on material characterization. However, the nature of this measurement technique also lends itself to applications involving vibration analysis, even though the full capabilities of DIC in this field
have yet to be extensively explored. In particular, three dimensional or Stereoscopic DIC (3D-DIC) measurements, which are capable of retrieving all three components of surface displacement and its position in a full-field instantaneous snapshot, are increasingly used for the recovery of natural
frequencies and of operational deflection shapes or mode shapes. While it has been already shown that, in comparison with more traditional vibration measurement techniques, such as Laser Doppler Vibrometry (LDV), the out-of-plane displacement component resolution is lower for DIC, the advantages
of the latter include such features as the applicability to tests where rigid body motions are present, and it's full-field nature that can deliver instantaneous snapshots of the displacement field, whilst at the same time, providing further output such as strain distribution. In the present
study, we discuss these advantages and limitations of 3D DIC measurements for vibration analysis along with an resolution cameras that can provide tens and even hundreds of kHz sampling rate has meant that increasingly more attention is paid to this technique.",
}